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Integrated Package Assembly

См. также в других словарях:

  • Integrated circuit encapsulation — (IC encapsulation, encapsulation) is the design and manufacturing of protective packages for integrated circuits. It is often the last stage of IC packaging (semiconductor package assembly) in semiconductor device fabrication. The integrated… …   Wikipedia

  • Package on package — (PoP) is an integrated circuit packaging technique to allow vertically combining discrete logic and memory ball grid array (BGA) packages. Two or more packages are installed on top of one another, i.e. stacked, with a standard interface to route… …   Wikipedia

  • Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… …   Wikipedia

  • Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… …   Wikipedia

  • integrated circuit — Electronics. a circuit of transistors, resistors, and capacitors constructed on a single semiconductor wafer or chip, in which the components are interconnected to perform a given function. Abbr.: IC Also called microcircuit. [1955 60] * * * ▪… …   Universalium

  • Package management system — A package management system is a collection of tools to automate the process of installing, upgrading, configuring, and removing software packages from a computer. Linux and other Unix like systems typically manage thousands of discrete… …   Wikipedia

  • Three-dimensional integrated circuit — In electronics, a three dimensional integrated circuit (3D IC, 3D IC, or 3 D IC) is a chip in which two or more layers of active electronic components are integrated both vertically and horizontally into a single circuit. The semiconductor… …   Wikipedia

  • Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips …   Wikipedia

  • Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads …   Wikipedia

  • electronic substrate and package ceramics — Introduction       advanced industrial materials that, owing to their insulating qualities, are useful in the production of electronic components.       Modern electronics are based on the integrated circuit, an assembly of millions of… …   Universalium

  • Content Assembly Mechanism — (CAM) is an XML based standard for creating and managing information exchanges that are interoperable and deterministic descriptions of machine processable information content flows into and out of XML structures. CAM is a product of the OASIS… …   Wikipedia

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